Methods, apparatuses, and systems for an innovation management system. The retaining elements may be displaced relative to the backrest, under the effect of the force generating device, by means of at least one connector guide, from a connector into a connector side block. The method also includes stitching the composite panels, adhesive layer, and adjoining layer together by passing a length of a flexible connecting element into the plurality of holes in the composite panels of material. The center wafer includes one or more vias substantially aligned and corresponding to the one or more bond pads.