A miniature BNC connector assembly having reduced dimensions includes a plug-side connector configured for engagement with a jack-side connector to form an electrical connection. Disclosed is an element sealing resin composition for organic electronic devices, comprising a polyisobutylene resin having a weight average molecular weight of 10,000 to 300,000 and a hydrogenated cyclic olefin-based polymer, and having a water content according to the Karl-Fischer method of 500 ppm or less and an amount of outgas generation of 500 ppm or less when heated at 85\xb0 C. % of at least one vinyl amide monomer ; b) from about 5 to about 45 wt.