By having substantially narrow pitches between wires in a first wiring layer located in an interlayer insulating layer of a semiconductor integrated circuit device, a total amount of the first wiring layer in the interlayer insulating film may be increased, thereby reducing a total amount of the interlayer insulating film having low hardness, which causes warping. The method may include obtaining a packet associated with a first address associated, by a home agent, with a first mobile unit and routing the packet to a second address associated with a second mobile unit along a forward link of a communication path that bypasses the home agent. The owner processor complex manages the adapter card except for a second port and receives error messages from the adapter card. The wire runs alongside a portion of the fiber optic cable length and is loosely held thereto. In this arrangement, light transmitted from the peripheral surface is transmitted through the rear surface to the liquid crystal panel.