A support body for a plurality of contact terminals included in a probe card for inspecting semiconductor devices formed in a semiconductor substrate is provided. The thermal treatment apparatus includes a process chamber for thermally treating the wafer, a heating unit for heating the wafer in the process chamber, and a gas supply unit for supplying a gas and controlling a gas pressure differently by sections of the wafer. The buck power conversion circuit is coupled to the light emitting diode string and has a power switch path. Further, the wastes can be treated in an anaerobic digestion process for producing biogas.