A subsystem of an avionics system is operated in a first mode for receiving software via a port; and in a second mode in accordance with a circuit that includes a terminator coupled to the port. An upper insulating layer covers the entire upper surface of the semiconductor construction assembly including the conductors except the pads. The curved body of the leads may be C-shaped in accordance with the present invention. The method includes inducing the fluid with electrical energy to change the dampening effects of the damper in real time.