There is provided a ball grid array electronic component package having a configuration which is capable of improving mounting efficiency as well as preventing footprints from breaking away at circuit-connecting portions of the electronic component package. The system can detect the real-time bio-signal and transmit the bio-signal data to the server by wireless communication. Dopant concentration may be changed to achieve desired thicknesses within preferred deposition times. 4 wt % Ag, and in that Ag and halogens contained therein satisfy the following relations: the molar ratio of Ag is 0.