A viscoelasticity measuring apparatus that measures viscoelasticity of a measurement target with high precision is provided. In one embodiment, a semiconductor wafer includes a semiconductor structure and a front-side metallization that includes front-side metallization elements for a number of semiconductor die areas. Thus, a three-dimensional element that is not in the edit state, a dimension line therefore, and a three-dimensional element that is not a projection source of the two-dimensional element in the projection drawing, and a scale line for the three-dimensional line are not projected. The driver circuit is configured to propagate a second drive signal in a second direction along the path when the transistors in the first set, before receiving the second drive signal, are in a second state. The pawl member is pivotally coupled to the reel unit.