In order to fabricate a semiconductor device, a semiconductor substrate in a peripheral region is etched to form a plurality of holes. The sealing device includes a sealing section located at the front and a ventilation section located at the rear. The securing arm further includes an armored sheath extending a length of at least seven feet and having an annular wall formed from at least two spirally-wound metallic strips interwound with one another to define a continuous interior cavity. The first oscillation device generates a high-frequency oscillation field when a current is directed perpendicular to the major plane of the first magnetic layer.