A bump of a semiconductor chip comprises a plurality of bond pads formed on a semiconductor chip, a conductive bump formed on the bond pads; and a sidewall insulating layer formed on sidewalls of the conductive bump. The electrolytic cell and method employ an anode, a cathode formed in part from beryllium oxide, and a molten electrolyte which includes cations of a metal that is capable of reducing beryllium oxide. A first method maintains a fixed position of detector, and raises or lowers the small tank of water. Further, the dock can enter one of several modes, including a call receipt mode and an entertainment mode. A polymer composite film for an active layer of a photovoltaic cell is produced according to this method.