A ventilated platenpolishing pad assembly for chemical mechanical polishing copper conductors on a semiconductor wafer is disclosed. In this case, where the magnification is not set in particular, information of 100% magnification is sent to the scanner CPU. This provides the user, in one embodiment of the present invention, with a visual indication of the type of information that accompanies television content. The transmitter may be triggered in response to the heat andor pressure generated by the blank upon firing. It uses water pressure to compress air in a pipe and the compressed air is collected in a pressure tank to be used later to run a power plant such as that described in CA patent no 2328580. According to the method deposition of the material can be effected with very high deposition rate and in case of etching very smooth etched surface is obtained.