A method for manufacturing a semiconductor package is disclosed. The transition module is provided with an external connector for receiving an input signal, an interface circuit coupled to the external connector and a processing unit for carrying out initial filtering and processing of the input signal before coupling the signal to a processor card connected to the backplane via the IO bus interface and the bus connector. Further, there are reactive functional groups, which are capable of reacting during thermal or radiation initiated curing. Surfactant may be added to the liquid base composition so that, when the composition is dried into sheet form, the sheet will generate foam when exposed to water and have cleansing properties.