Exemplary embodiments provide interconnects and methods for interconnecting an electrical device array with a flexible circuit by filling a chemically-etched or laser-ablated integral stencil with conductive materials. The BOT structure includes a first work piece with a metal trace on a surface of the first work piece, wherein the metal trace has a first axis. The shaft is assembled by stretching the sleeve over the inner core and securing the stretched sleeve to the inner core, the sleeve causing the inner core to curl as the sleeve returns to its unstretched length. Thereby, the support rigidity of the handle base can be increased, thereby properly preventing the handle base from moving by an improper access. The optical device may also include a patch panel cleaner to automatically clean the through holes of the patch panel, and a connector cleaner to automatically clean the first male connectors or the second male connectors.