Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer are provided. The method forms a first dislocation stress memorization region and a second DSM region having stressed lattices within a substrate. and 90% RH in a structure in which the first barrier layer is formed on the base is R1 and the water vapor transmission rate at 40\xb0 C. sending a signal on the radio connection from the network part transmitter using the transmission power required.