A semiconductor package is disclosed for packaging two adjacent semiconductor dies atop a circuit substrate. The method comprises establishing a correlation between permanganate absorbances of standard samples and their PRC contents and determining the PRC content of the acetic acid sample by measuring its permanganate absorbance of a reaction mixture containing a standard permanganate solution and the acetic acid sample. Consequently, the blade and the work are prevented from being damaged by processing the work without applying coolant, the mechanism of the dicing machine and the blade attaching and detaching device are prevented from being damaged without detaching the blade attaching and detaching device, and the work is prevented from being being unprocessed. The geometrical patterns have hinged polygons that rotate with respect to each other when the sole is under lateral or longitudinal tension, thus increasing the lateral and longitudinal dimensions of the sole.