A semiconductor device is disclosed allowing detection of a connection state of a Through Silicon Via at a wafer level. The tension measuring system includes a center assembly that is used in combination with a pushing assembly and a horizontal stabilizer assembly such that when a deflection operating assembly is used actuation of the deflection operating assembly causes the pushing assembly to provide deflection to the belt of the conveyor. The image clipping section clips respective data of substantially overlapping image regions of the plural images of different luminance.