Embodiments relate to a semiconductor device, a semiconductor wafer structure, and a method for manufacturing or forming a semiconductor wafer structure. The system includes two electric motorgenerators connected to each other in such a fashion so that when one electric motorgenerator functions as a motor, the other becomes a generator with their roles being reversed depending on whether the system is in an auxiliary power mode or energy storage mode. Each numbered die includes twelve sides with two sides assigned to dots one thru four. Preferably, the softening active ingredient is a quaternary ammonium compound with the formula:.