A method is provided for making an electrical connection with a microelectronic component arranged on or embedded within a surface of a circuit board layer or a substrate. The Method involves the use of mould having a cavity and at least one entrance opening. The device forms an erected state and a lowered state, depending on whether the support elements are filled or not. By using inexpensive and readily available substances as sintering aid and as pore formers, a low-cost cathode is provided. Two further abutment regions are formed between the two holder recess lower surfaces and the two insert protuberance upper surfaces. The selected advertisement may be retrieved from client memory, or a request can be sent to a remote server to send the selected advertisement to the client.