A method for optimizing the design of a chip or system by decreasing the cost function that encompasses a plurality of constraints in the presence of variations in the design parameters is described. The film is bonded by heating the film above a glass transition temperature of at least one of a thermoplastic polymer from which the film is made and a polymer from which an imaging layer of the flexible imaging member is made. A substantially ideal upper layer signal is reconstructed from the demodulated and decoded upper layer signal including matching an ideal amplitude and an ideal phase by applying the upper layer amplitude factor and the upper layer phase factor to the reconstructed ideal upper layer signal.