A flip chip bonded package applicable to a fine pitch technology uses, inter alia, insulative posts instead of using conductive bumps, which correspond to electrodes one by one. A portion of the insulating tape exposed outside the sealing surface of the case is extended and the extended portion of the insulating tape comes in contact with the end portion of the sealing surface after being folded. The adjusting module is disposed on the telescopic post corresponding to the switch and for pushing the switch. The first error correcting code is configured to provide error recovery from a structured burst error in one of the subsets of data, the structured burst error having a length less than a specified maximum length.