A method for closed-loop control of the surface temperature of a glow plug. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. A non-wetting layer is formed on a sidewall of the metal pillar, wherein the non-wetting layer is not wettable to the molten solder. A measure is calculated of the subject’s strength of associations involving each of the first and second categories with each of the third and fourth categories from the latency measurements. The applied palpatory force versus displacement is detected in response to applying and withdrawing the palpatory force to the wire or the plunger.