The invention discloses a chip testing circuit that increases the testing throughput. The local etching apparatus includes a plasma generator 1 to cause plasma discharge of a mixed gas of CF4 and O2 fed from a gas feeder 3 to an alumina discharge tube 2 to produce F radicals R and spraying the F radicals R from the nozzle portion 20 to a silicon wafer W on a chuck 93 so as to locally etch the silicon wafer W. A central electrode is disposed inside of the base object. The signal gain controller provides a signal gain that is a function of the filament resistance and the load resistance. Further, the system and method relate to the use of x-ray diffraction to non-destructively characterize parts and components to determine whether to accept or reject those components or parts for use in application. An exemplary cathode has the configuration: SVOfirst current collectorCFxsecond current collectorSVO, and wherein the anodic coulombic capacity does not exceed the total coulombic capacities of the SVO and CFx by greater than 25%.