Photosensitive insulating films are laminated on lower-layer interconnection layers and a connection hole is formed in the photosensitive insulating film, and a interconnection groove is formed in the photosensitive insulating film. An apparatus may include a processor configured to provide a user interface allowing a user to select a device power profile from a plurality of available device power profiles. The support rings include support surfaces on outer circumferences thereof, and engagement projections on inner circumferences thereof, such that by engagement of the projections in the concave grooves, the support rings are mounted on the seal member so as to surround outer circumferences of the shoulder portions.