A method and apparatus for inspecting an object is provided. The semiconductor chip package can combine industry standard die having conductive back sides with flip chip bump bonding to provide discrete and integrated devices that require less space on a printed circuit board. A static image indicating a low contrast image is uploaded to the web server when a width of the distribution is less than a predetermined threshold value; otherwise, the captured image is uploaded to the web server. The tangle of thread runs through a heating area in the transition area between the texturing device and the cooling device, the heating area being essentially defined by the distance between the tangle outlet of the texturing device and a tangle receiving element of the cooling device. The interval between the external and internal panes can vary from about one to about two millimeters, and at least one of the internal and external panes is adapted to be attached to a substantially smooth surface.