A method for selectively depositing a source material on a wafer is disclosed. The device includes a plurality of first topographic structures comprising conductive lead lines deposited on a semiconductor substrate, and a plurality of second topographic structures comprising fill patterns such that the top surfaces of the second topographic structures are generally coplanar with the top surfaces of the plurality of first topographic structures. At least the sipes formed in the blocks constituting the center region are three-dimensional sipes each having a zigzag shape extending in the width, circumferential and radial directions of the tire. The exterior surface of the door is provided with separate handles to selectively initiate respective sliding or pivoting movement.