In a solder that realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a connection portion between a semiconductor device and a substrate is formed of metal balls made of Cu or the like and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds. In at least one preferred embodiment, automated apparatus capable of reliably, automatically testing surface finishes in industrial environments. The power is received on a first pair of taps on a first communication port. The cutting tool may further comprise a ring cutter, wherein the ribbon wire passes through a ring having a cutting surface defined about an inner diameter thereof. The first section 26 has a pair of jaws 30, 32, in crimping engagement with the upper contact surface 20.