A stacked printed circuit board memory module in which a plurality of daughter circuit boards can be stacked onto a primary circuit board. The copper alloy is built on the base of copper, zinc and silicon without toxic additives and consists of: 70 to 83% Cu, 1 to 5% Si and the further matrix-active elements: 0. The package film tension adjusting device includes a chassis inside which two rails are fixed. The tape includes a flat shape when it is wound on the reel.