The present invention discloses a sealing system for sealing together at least a pair of flexible pouch material layers. The housing encloses a gelled adhesive composition. The N-type metal-oxide-semiconductor transistor is coupled between the third terminal of the first P-type metal-oxide-semiconductor transistor and the current source. Thereafter, heat is supplied in a second stage to the coil terminal, and thus a protrusion of the coil terminal is melted to join the coil wire and the coil terminal to each other at the wound portion.