A semiconductor package includes a lead frame having a die paddle and a plurality of leads connected to die paddle, where each lead has a lead surface parallel to die paddle and is a continuous extension bending upward from die paddle. The end-point node autonomously determines a path satisfying predetermined transmission conditions as an optimal pathway of said wavelength path, on the basis of cumulative span information transmitted over the respective plural pathways from the starting-point node to the node of interest. The health monitor may analyze these events andor other information to determine when a connectivity problem may have arisen, and if a problem is determined to be imminent or to have occurred, may initiate recovery procedures.