In one embodiment, a circuit board assembly comprises a first circuit board comprising a first array of alignment holes, a second circuit board comprising a second array of alignment holes, and at least one press pin dimensioned to fit in one or more of the alignment holes. The machine determines when it has returned to a previously visited position within the area. The disks are mounted in spaced-apart relation on the center conductor pin and have different radiuses which decrease with increasing distance from the base of the center conductor pin. Data flows can be re-assigned on an as-needed basis to insure maximum throughput. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. Reductive carbonylation processes using the catalyst composition to produce aldehydes are also provided.