Wafer geometry measurement tools and methods for providing improved wafer geometry measurements are disclosed. The first body and the second body have two predefined positions, an open position and a closed position. Each of the first and second resistance components are determined as a function of parameters of the assumed environmental and battery state conditions. More specifically, the present invention relates to providing the capability to customize multiple context menus, and flatten the command hierarchy of an imaging system. The second structural layer includes an inside surface having an interior of the sound-directing component through which sound energy is directed. The first portion includes a thread for engaging cancellous bone within a portion of a bone on one side of a fracture.