A plurality of the recessed portions are formed in an array on the opposite surface side of the semiconductor substrate and a second conductive type semiconductor region composed of a second conductive type semiconductor is formed at bottoms of a plurality of the recessed portions to obtain photodiode arrays arranged in an array. Methods are also disclosed for reducing, reducing below a given level or eliminating noxious sulfur species from fluids using the inventive scavengers and for making the inventive scavengers. An edge area of the strip is configured to immediately re-capture coins as they are released at the exit area and to hold the coins until they pass by a segment of the strip that is far enough away from the indexing line of the coins that they are no longer captured, but are freely released. The binder is then reacted to yield a ceramic-containing repair coating that covers the surface area of the component and comprises the ceramic powder in a matrix of a material formed when the binder was reacted.