An inline transfer system and method are provided for the secure transport and efficient processing of substrates such as glass substrates or semiconductor devices. The strain relief feature includes a pair of clamping members that span between mounting surfaces at a rear portion of the connector to define a strain relief passageway in which the wire bundle is clamped to provide a strain relief. The donor eNB can determine a number of devices served by the relay for discounting the historical throughput, and accordingly assigning resources based on the number of devices instead of the single relay.