There are provided a carrier substrate, a temperature sensing resistor film formed directly on the carrier substrate, first and second conductive patterns formed on the carrier substrate and connected to both ends of the temperature sensing resistor film respectively, and a semiconductor chip mounting region portion formed on the carrier substrate. The alloys have improved strength and hardness, over single phase alloys, due to coherency strain between the phases. A mouthpiece has a gas passageway and a retainer passageway and a first end of the gas passageway communicates with the internal chamber while a second free end of the mouthpiece has a gas opening therein. The surfaces of each bulkhead-engaging portion include a plurality of chamfers to create complementary surfaces in the panel being formed.