A switching chip using silicon as the base material is located on the upper surface of a cooling mechanism formed of a heat sink, an insulating substrate and a conductive plate, with a first conductive layer sandwiched in between. The light energy plate is suitable to receive light energy and convert the light energy to electrical energy. At least one switch connects to the bank of integrated circuit filters. The slit and the feeding part divide the first metal sheet into a first radiating part and a second radiating part. In this manner, the platen separates from the thermal head, and setting a recording sheet becomes easier.