A semiconductor device includes a substrate having a first side and a second side and an epitaxial layer disposed over the second side. The gate oxide is disposed on the substrate and the gate is disposed on the gate oxide. A respective fluid outlet port is associated with each respective fuel injector and being fluidly couplable thereto for conveying actuating fluid to the respective fuel injector; and at least one fluid cavity having at least one throttling orifice, the orifice effecting fluid communication between the fluid cavity and the fluid passageway. A buyer becomes a registered participant by applying for a virtual payment account. The semiconductor package includes a first substrate having mounting electrodes on both surfaces thereof; a plurality of electronic devices mounted on both surfaces of the first substrate; and a second substrate exposed in cavities and bonded to a bottom surface of the first substrate so as to accommodate the electronic devices mounted on the bottom surface of the first substrate in the cavities.