A method of evaluating configuration of solder external terminals of a BGA-type tape-based semiconductor device mounted on a board such that the external terminals are joined to lands provided on the mounting board is provided. The second portion is slidably engaged with the first portion. The apparatus and method may be part of a network linking a plurality of apparatus to a central control and database of beverage information. A readback signal response is obtained at an output test point of the read channel. The device may provide state information associated with the second audio andor video configuration via a first session initiation protocol message.