A substrate processing method which removes an ArF resist film from a wafer having the ArF resist film. In order to maintain operation during a fuel cut-off situation, the sensor malfunction monitor is arranged to control the fuel cut-off sequencing. Each of the plurality of code words of the set is uniquely associated with a data word having first and second fields. The dielectric film is formed on the upper surface of the transparent electrically-conducting layer. The data result and error information are provided together in a package but separated by an indicator to distinguish between them.