A method for forming a solder mold for transferring solder to a wafer includes etching a plurality of solder cavities into a substrate. The transmission schedule is written in a tabular form in which a block type of the system information is displayed at a position to which a frame for transmitting the system information is allocated. The drive rod is moveable within the blade bar. A plane is drawn through the receiver element, and the direction of the signal is determined as generally perpendicular to the plane, in the direction of the sensors which are receiving the signal. Accordingly, the present technique handles the data more efficiently by accessing the image data in blocks corresponding to the plurality of resolution levels, rather than accessing the entirety of the image data. The torque converter is employed to increase the rotational speed of the load to the maximum speed permitted by the torque converter.