A connection verification apparatus verifies interconnection between a plurality of logic blocks constituting a semiconductor integrated circuit or the like. The collimator can be positioned next to a compound. Using the curl-forming apparatus, adjacent parts of the reinforcing material-attached profile strip are subjected to plastic deformation to form spirals by being provided with arc-like curls having a radius of curvature substantially similar to or not greater than the radius of curvature of the spiral pipe. In one embodiment, a commercially available CREE PFM19030SM power module is used in both the main amplifier and the peak amplifier.