A semiconductor device with a plastic package molding compound, a semiconductor chip and a leadframe is disclosed. For example, highly stressed dielectric fill material including compressive and tensile stress may be appropriately provided in the respective isolation trenches in order to correspondingly adapt the charge carrier mobility of respective channel regions. The robot is provided with a holiday detector in the form of a conductive brush mounted on a rotatable hub and adapted to sweep against the weld seam so as to locate any voids in the coating by means of electrical conductance, thus causing a holiday marker to activate and mark the pipeline interior surface so that the site can be revisited for repair.