An apparatus and system for removing an obstruction from a body lumen simultaneously mechanically dislodges the obstruction, macerates the obstruction, and aspirates the effluent caused thereby. An inversion circuit inverts the extracted VT relative to a reference voltage that is intermediate the first voltage rail and a second voltage rail and provides an output corresponding to the VT relative to the second voltage rail. Hard sidewalls are formed in the ILD allowing a thin barrier layer to be used in a dual damascene copper and porous low-k without pore sealing steps. As a first alternative, the lens is retained to the shoulder and has a sealing edging is fitted around the perimeter of the lens. The first circuit board is disposed to extend substantially horizontally, and the second circuit board is disposed to extend substantially vertically with a horizontal gap provided between the first circuit board and the second circuit board. The semiconductor wafer is then etched through the gaps in the patterned mask to singulate the integrated circuits.