A method of order allocation is disclosed. The system also includes a host engine coupled to the emulator and configured to perform instructions in the second format. The at least at least one seed layer is a material for providing a buffer for differential thermal expansion of the outer layer and the light reflecting layer. This realizes a three-dimensional die capable of being opened onto a two-dimensional plane, which has only been fictionally conceived, and further provides a manufacturing method thereof. Additionally, embodiments may include steps for a hybrid weighing method for suppressing artifacts.