The present invention relates to a chip packaging method and structure, in which bonding pads provided on the chip are connected by a plurality of metal wires via bonding, each of the metal wires is bending in the middle part to be higher than a predetermined height, and its ends are respectively electrically connected with two of the bonding pads. The technology depends on the viewers natural monocular cues combined with the optical distortion of the Lens to acquire this Holographic 3D effect. In addition, one or more limit sensors are located at the container, each of which furnishes a signal indicating whether the contents level is above or below a level to be monitored by the limit sensor and which is situated between the minimum and maximum contents levels of the container. When the ends are secured to the sides of the frame, the band holds separated tissues together and establishes a path of tension along its length that extends linearly between the two ends of the band. The method includes detecting a user gesture on a page, checking a number of touch points of the user gesture, processing an object in association with the number of touch points of the user gesture, where the processing of the object is one of storing the object in association with the number of touch points as clipped data and pasting the clipped data identified with the number of touch points.