A method performed on a wafer having multiple chips each including a doped semiconductor and substrate involves etching an annulus trench, metalizing an inner and an outer perimeter side wall of the annulus trench, etching a via trench into the wafer, making a length of the via trench electrically conductive, thinning a surface of the substrate. In some embodiments, memory integrated circuits and accompanying AMBs, or accompanying memory registers, are arranged in two ranks in two fields on each side of a flexible circuit. On the other hand, an engine output is calculated based on input and output heat quantity, and a difference between the engine output based on the torque and the engine output based on the input and output heat quantity is obtained in advance. The base plate is coated with a first electrically-conductive pattern that forms a first electrode. Downstream of said detection means, an electronic signal processing system is provided, operative to the effect that the power reduction required in the optimized condition of the wind power plant will be restricted to obtain optimum economical efficiency under the current operating conditions, both in cases of winds in the range of the nominal wind velocity and in cases of high wind velocities. A notification is received that one or more data objects have been logically deleted by deleting metadata about the one or more data objects, wherein the notification provides storage locations within one or more logical storage volumes corresponding to the deleted one or more data objects, wherein each of the one or more data objects are divided into one or more extents.