An electrical connector for electrically connecting an IC package to a circuit board includes an insulating housing having a plurality of receiving holes and a plurality of contacts received in the receiving holes. The method includes determining a polishing characteristic for a particular type of device from a set of measurements obtained from a wafer having a device of the particular type, and updating the polishing characteristic in response to polishing and measuring a wafer having a device of the particular type. In one embodiment, the user is presented with an adjustable user interface widget such as a slider that allows the user to select any shading setting along a shading continuum. The ID unit receives the ID code and checks the received ID code through an authentication database. The fusable devices may be antifuses. The outlet end of the connector body includes a central axis.