Solder bump connections and methods for fabricating solder bump connections. Each individual circuit blocks contains internal circuits to control data transfer to nearby circuit blocks. The light inlet section includes a first surface facing the light source and a second surface which intersects the first surface at an angle smaller than 90. The portable memory module can further include a connector including a first portion coupled to the controller and a second portion configured to mate with a host device. Wherein, the present invention further enhances the processing performance of image correction computation by a memory allocation technique. In other aspects the invention relates to the use of these compounds in a method for therapy and to pharmaceutical compositions comprising the compounds of the invention.