A method of forming active areas and isolation regions in a semiconductor substrate using a double patterning process. Si-based electronic structures can be printed in a simple low cost process and thus being a potential alternative to obtain a low cost manufacturing process for, e. In one embodiment, when the well is pressurized the tool can be loaded with one or more items to be dropped. The stripping solvent used to form the stripping solution may comprise a mixture of acetic anhydride with a co-solvent selected from the group consisting of a carbonate containing 2-4 carbon atoms, ethylene glycol diacetate, and combinations thereof. The threadable tensioning line is tightened when the handle is pivoted in the direction of the second end of the device.