A method for manufacturing a semiconductor package with a laminated chip cavity is disclosed. The interconnect structures may contain an interconnect line, an electrolessly deposited metal layer formed over the interconnect line, a via formed over the metal layer, and a second interconnect line formed over the via. Because scripts are typically short and complete quickly, the overhead to start and end a request containing a script is much less than the overhead of locking each and every object access done by the script, on average. The non-homogenous electric field produces an increased density electric field in the region of the cleavage furrow. As a result, the cost for the adjusting process is reduced and the adjusting process is executed at high speed. The system collects instrumentation items, for historical usage data, that record aspects of users’ interactions with the system.