The present disclosure relates to a tool such as an injection moulding tool or an embossing tool. The device includes an array of MEMS elements with addressing lines and MEMS switches configured to selectively connect the addressing lines to a ground or other potential in the event of an over-voltage, such as during an ESD event. Accordingly, transistor operations can utilize the current path above and below the gate electrode. Preferably, a torque variation is suppressed by controlling the ignition timing of each cylinder before IVC is advanced.