Via-shaped copper interconnect lines buried in an interlayer insulating film are connected to gate interconnect lines in the lowermost layer. For example, in one disclosed embodiment a method includes displaying a virtual marker visually alignable with a real world target at an alignment condition. Fasteners extend through the hinge of the armored door, the pillar armor and an original equipment manufacture pillar using holes other than the original equipment manufacture holes. The temperature of the chamber is preferably at least about 300 degrees Celsius. The present invention provides a polyurethane resin excellent in gas barrier properties against water vapor, oxygen, aromatics, and others, and a film containing the same. A side locker is provided on each side end of the upper and lower panels of the box modular for connecting with another box modular in such a manner that the switch box having a desired number of sockets is capable of being formed by selectively connecting the box modulars together.